Waifu IC
– A service provider specialized in IC technical support,
supply chain management and product solutions.
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•Technology Node:6nm — 500nm
•Technology Type：HV 3D CIS，NVM， RF CMOS ，Flash， Logic， Analog， Mixed signal， 3D CMOS MEMS， BCD
Collaborative Fabs (partial)
IC packaging & Testing
•packaing type：SOP,QFN,QFP,SOT, LGA •MEMS,FC,SIP,Flip chip,TSV+2.5D/3Dpackage
Collaborative Fabs (partial)
Other Multi-levels, Multi-dimensions Business
•Chip Solutions
•finished product purchase
•internel alternative product in China
•Equipments Resources and Construction of Factory
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